机构地区: 江西理工大学材料与化学工程学院
出 处: 《热处理》 2007年第1期24-28,33,共6页
摘 要: 引线框架是集成电路中的一个关键组成部分,近年来,引线框架材料得到了极大的发展。论述了引线框架铜合金的设计思路,介绍了不同高强高导铜合金的强化机制和导电原理,并分析了C194铜金合金的强化机制。 The lead flame is a key component of integrated circuit. Materids used for the lead frame has been considerably developed in recent years . Various design concepts of copper alloys for the lead frame were reviewed, and the strengthening mechanism and the electric conduction principle of different high-strength and high-conductivity copper alloys introduced,with the strengthening mechanism of C194 copper alloy being analyzed.