作　　者： ; ; ;

机构地区： 山东大学材料科学与工程学院材料液态结构及其遗传性教育部重点实验室

出　　处： 《焊接技术》 2007年第1期36-38,共3页

摘　　要： 针对铝和铜异种有色金属钎焊工艺,从钎料选择、焊前清理、接头装配和钎焊工艺要点等方面对Al/Cu真空钎焊的去膜机理和界面结合特点等进行了研究,分析了真空钎焊加热温度、升温速度、保温时间和真空度等工艺参数对钎焊接头性能的影响。结果表明,Al-Si钎料中加入1%～1.5%的Mg作为活化剂,有利于铝母材表面氧化膜的去除;加热温度、保温时间及钎料用量对母材溶蚀的产生具有重要影响。 Aimed at the vacuum brazing technology for Al/Cu dissimilar nonferrous metals, removal mechanism of the oxide film and combination character of the interface were studied regarding filler selection, cleaning of the workpieces, joint fitting and brazing technology key-point. The effect of the brazing temperature, heating rate, holding time and vacuum degree on the performance of Al-Cu vacuum brazing joint was analysed. The results indicated that Mg of 1%～1.5% added into the Al-Si filler metal was beneficial to the removing of the oxide film. The erosion of the base materials was affected by the brazing temperature, holding time and quantity of the filler metals.

关 键 词： 真空钎焊 去膜机理 钎料 溶蚀

领　　域： [金属学及工艺]