作　　者： ; ; ; ;

机构地区： 国防科学技术大学光电科学与工程学院

出　　处： 《光电子．激光》 2007年第1期49-50,54,共3页

摘　　要： 针对光纤F-P干涉仪(FPI)传感器封装普遍采用的化学胶水粘合方式存在的胶水老化而脱胶的问题,提出一种用高频CO2激光脉冲加热使光纤与石英管永久熔合进行封装的新方法。实验表明,在激光脉冲能量选择适当时,加热封装过程所导致的干涉仪平均光功率损耗可低至0.1dB左右,可满足封装的要求。 Chemical glue is often used to encapsulate fiber-optic F-P interterometnc sensor to fixup the F-P cavity, Which is easy to come unglued as aging. A new encapsulation method to melt fiber and quartz glass tube by high-frequency CO2 laser is put forward. The experimental results show that the average cost of power can be as low as 0.1 dB if the proper power of laser pulse is chosen,which can satisfy the demand of encapsulation,and thus the method has applicable value.

关 键 词： 光纤传感器 干涉仪 激光 封装

领　　域： [电子电信]