作　　者： ; ; ; ; ;

机构地区： 华南理工大学化学与化工学院

出　　处： 《陕西科技大学学报（自然科学版）》 2006年第6期16-20,共5页

摘　　要： 研究了积层电路板用UV固化光敏油墨的制作、配方和应用工艺,考察了氰酸酯树脂的含量对油墨性能的影响,分析了过显和显影不足问题的形成及原因。结果表明,在研究范围内,随着氰酸酯含量的增加,固化膜的热稳定性和介电性得到了较大的改善。此外,喷淋压力、显影速度和曝光能量是影响生产积层电路板中显影问题的3个主要因素,通过对以上3个因素的调节可以得到正常的显影。 The preparation, composition and application technology of the UV-curable photosensitive ink for Build-up Multilayer （BUMB） were studied and the effect of cyrante resin mass percentage composition on ink was investigated and the problems of underdevelopment and overdevelopment were analyzed in this paper. The results showed that the thermal stability and the dielectric properties of the cured film are greatly improved with the increasing cyrante resin mass percentage composition within the range of research. The spraying pressure, development speed and exposure energy pay more influences on the development in the process for fabricating a BUMB and proper-development may be obtained based on the regulation of them.

关 键 词： 光敏油墨 氰酸酯树脂 成像 热稳定性 介电性

领　　域： [化学工程] [化学工程]