作　　者： ; ; ; ; ; ;

机构地区： 华中科技大学机械科学与工程学院

出　　处： 《半导体技术》 2006年第11期819-822,827,共5页

摘　　要： 基于晶片的红外透射原理,设计并搭建了晶片直接键合质量红外检测装置,并利用图像处理技术开发了相应的软件模块,可以快速获取键合界面的特性参数,如空洞分布、大小及键合率等,从而实现晶片直接键合质量的快速评估。同时,将该红外检测装置与硅片键合装置结合一体,可以实时监测硅片直接键合工艺。通过分析不同工艺条件下所获得的键合片质量,包括键合率、缺陷分布以及键合强度等参数的比较,可以有助于理解晶片键合的机理,实现键合工艺的优化。 Based on the infrared transmission theory, an IR-detecting instrument for testing wafer bonding quality were framed. Image processing technology was used for exploiting relevant software module, the characteristic parameters of the bonding interface, such as voids＇ distribution, size, and bond yield could be quickly obtained. Sequentially, the primary evaluation of the wafer bonding quality was realized. Combined this instrument with wafer-bonder, the real-time supervision of bonding process was achieved. Combining bonding strength, the parameter of bonding techniques was optimized by analyzing the wafer bonding quality, which include the bond yield and distribution of voids, in different bonding condition. It is helpful for comprehening the mechanism of wafer bonding.

关 键 词： 键合质量 红外检测 图像法 晶片键合

领　　域： [电子电信]