作　　者： ; ; ; ; ; ;

机构地区： 华中科技大学机械科学与工程学院

出　　处： 《半导体技术》 2006年第10期729-732,共4页

摘　　要： 根据薄板弯曲理论,推导出晶圆表面翘曲度及夹具形状影响晶圆直接键合的理论公式,很好地解释了晶圆材料性质及尺寸大小对直接键合的影响。利用理论公式比较了晶圆在外压力和无外压力作用下翘曲度对晶圆直接键合的不同影响,结果表明晶圆键合后的形状由晶圆的初始形状及键合所用的夹具决定。最后应用有限元进行了仿真分析,仿真结果表明,晶圆存在一定翘曲度时施加合适的外压力将有助于晶圆的直接键合。 The analytical expression of the effect of wafer bow in wafer direct bonding was deduced according to the elastic mechanics of thin plate. The results demonstrate the effect of material characters and dimensions of wafer on wafer bonding. The effect of wafer bow in wafer direct bonding under pressure and without pressure was also compared. It was demonstrated that the wafer-scale shape of a bonded wafer pair was determined by the initial shapes of the wafers and the mounting configuration used during bonding. Finally, the situation was simulated by finite element analysis, and the results indicate that a proper pressure is helpful to enhance wafer direct bonding under a special wafer bow condition.

关 键 词： 晶圆直接键合 翘曲度 弹性应变能 有限元 仿真

领　　域： [电子电信]