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热熔压敏胶的应用现状及发展
Present Situation of Application and Development of Hot-Melt Pressure Sensitive Adhesives

作  者: ; ; (吴伟卿); (尹朝辉); (李建宗);

机构地区: 华南理工大学材料科学与工程学院

出  处: 《化学与粘合》 2006年第5期338-341,共4页

摘  要: 综述了热熔压敏胶的特点及其在欧美等发达国家和我国的应用现状,对改良型热塑性弹性体热熔压敏胶、丙烯酸酯类热熔压敏胶、有机硅类热熔压敏胶和无定形聚烯烃类热熔压敏胶的发展及应用进行了介绍。建议国内企业和科研机构开发多种用途的热熔压敏胶,扩大其使用范围,同时应加快压敏胶性能标准化进程。认为环保型和多功能化是今后热熔压敏胶的发展方向。 The characters of hot - melt pressure sensitive adhesive (FIMPSA) and its present situations of applleation in the developed Occident and China were introduced. The develotxnents and applications of modified themaoplastie elastomer HMPSA, aerylate FIMPSA, silicone FIMPSA and amorphous polyolefin HMPSA were revlewed in this paper. It was suggested that domestic enterprises and research institutes should exploit mulfifunetional HMPSA to extend its application and expedite the process of perforrtumce standardization as soon as possible. It was also considered that the environment - friendly and muir/functional HMPSA were the development trends.

关 键 词: 热熔压敏胶 应用现状 发展

领  域: [化学工程]

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