作　　者： ; ; (李大树）; (黄奔宇）;

机构地区： 华南理工大学机械与汽车工程学院

出　　处： 《材料保护》 2006年第7期64-65,75,共3页

摘　　要： 分析了化学镀镍浸金过程中金层厚度不均的现象及其产生的原因。试验发现,面积不同的铜面发生电气互联时容易造成金厚不均的现象,而无电气互联情况时,金厚均匀性比较好。导致金厚不均的原因有两种情况,一种是电势影响,二是双极性效应。 The thickness nonuniformity of the immersion-gold layer in electroless nickel plating and the causes leading to the nonuniformity were explored. It was found that the thickness nonuniformity of the immersion-gold layer was significant when the parts or devices of different area experienced electric connection, and it became insignificant in the absence of electric connection. The thickness nonuniformity of the immersion-gold layer in the electroless nickel plating process was attributed to two main aspects, i.e., the original battery effect and the bipolar electrode effect.

关 键 词： 化学镀镍 浸金 双极性效应

领　　域： [化学工程]