作　　者： ; ; (陈志传）; (廖蔚峰）;

机构地区： 广东工业大学轻工化工学院

出　　处： 《广东工业大学学报》 2005年第3期21-24,33,共5页

摘　　要： 介绍一种印刷电路板化学镀铜废液回收EDTA的方法.利用化学镀铜废液中残留的HCHO,采用在强碱条件下还原除铜,调整废液的pH回收EDTA.该方法Cu的去除率达99.6%,EDTA的回收率大于98%;用回收的EDTA制备EDTA-Na2,纯度大于98.5%.实现化学镀铜废液的回收和循环使用. In this paper copper is reduced by formaldehyde which is contained in the wastewater of chemical copper plating. The EDTA acid can be recycled after acidulation. Using EDTA, EDTA-Na2 and new chemical copper plating solution are prepared. It is shown that the removal rate of copper is 99.6%. The EDTA recovery is more than 98%, and the purity of EDTA-Na2 which is made from EDTA is more than 98.5%. It can be used in industrys of chemical copper plating again.

关 键 词： 印刷电路板 化学镀铜 回收利用

领　　域： [环境科学与工程]