机构地区: 华中科技大学材料科学与工程学院
出 处: 《半导体技术》 2005年第8期8-12,17,共6页
摘 要: 讨论了将成为21世纪电子制造领域的核心科学与技术的纳电子封装的基本概念以及由其产生的驱动力。阐述了纳电子封装的研究内容和纳电子封装的现状及发展趋势。 The basic definition of nanoelectronic packaging, which is becoming the core science and technology for the field of electronic manufacture in the 21 century, and the driving force caused by it are discussed .The contents of nano electronic packaging, as well as its status and developing trend are described.
领 域: [电子电信]