作　　者： ; ; ;

机构地区： 广东工业大学材料与能源学院

出　　处： 《电镀与涂饰》 2005年第7期21-24,共4页

摘　　要： 研究了铝-硅合金表面化学沉积Ni-Cu-P的工艺条件,探讨了镀液组成对镀速的影响,确定了最佳工艺条件为:ρ(硫酸镍)为30～40 g/L, ρ(硫酸铜)为0.6～0.8 g/L,ρ(次磷酸钠)为25～30 g/L, ρ(柠檬酸钠)为40～50 g/L, ρ(醋酸铵)为30～35 g/L,温度为80 ℃,pH值为6.0.通过扫描电镜、X-射线衍射法探讨了合金镀层的形貌与结构.测定了镀层硬度和阳极极化曲线,结果表明:以该配方所得的镀层表面平整、光亮;未经热处理的镀层呈非晶态结构,随着热处理温度的升高,镀层的显微硬度先增后降,当温度达到400 ℃时,镀层结构晶体化,其显微硬度达到最大,为1 050 HV;镀层在3种介质中的耐蚀性顺序为:硫酸(体积分数为10%)>氯化钠(质量分数为10%)>氢氧化钠(质量分数为10%). The process conditions of electroless Ni-Cu-P plating on Al-Si alloy were studied. The influences of solution components on deposition rate were investigated. The optimal process conditions were identified as follows: 30～40 g/L of nickel sulfate, 0.6～0.8 g/L of cupric sulfate, 25～30 g/L of sodium hypophosphite, 40～50 g/L of sodium citrate, 30～35 g/L of sodium acetate, 80 ℃ and pH value of 6.0. The morphology and structure of alloy deposits were studied with scan electron microscope and X-ray diffraction methods. The deposit's hardness and anode polarization curve were determined. The results show that the deposits gained from this formula are level and bright. And the deposit has non-crystal structure before heat treatment. The microhardness increases firstly and then decreases with increase of heat treatment temperature. When the temperature increases up to 400 ℃, the structure of deposit becomes to crystal, and its hardness is up to the maximum of (1 050 HV.) The order of deposits corrosion resistance in three media is as follows: sulfuric acid (10% by volume)>sodium chloride(10% by mass)>sodium hydroxide (10% by mass).

关 键 词： 化学沉积 铝硅合金

领　　域： [化学工程]