机构地区: 广东工业大学
出 处: 《机械科学与技术》 2005年第5期570-571,608,共3页
摘 要: 介绍笔者设计的IC芯片粘片机斜面四连杆式的焊头运动结构。阐明斜平面、摆臂平行四边形、端面凸轮等部分的设计和原理。 We present the mechanical structures of the bonding head in the die bonder by the means of oblique plane and quadrilateral connecting rods. The parts design and principle were discussed that includes the oblique plane, the swing arm parallelogram, and the end plane cam.
领 域: [电子电信]