作　　者： ; ; ; ; ;

机构地区： 哈尔滨理工大学材料科学与工程学院

出　　处： 《哈尔滨理工大学学报》 2005年第2期125-128,132,共5页

摘　　要： 以电子封装基片为应用背景,采用挤压铸造方法制备了体积分数为55%,不同颗粒粒径增强的SiCp/Cu复合材料,并分析测试了颗粒粒径和热处理状态对材料热膨胀性能的影响规律.显微组织观察表明,复合材料颗粒分布均匀,材料组织致密;热膨胀性能测试表明,随着温度升高,复合材料的热膨胀系数呈非线性增加;SiC体积分数相同时,减小SiC颗粒尺寸有利于降低复合材料的热膨胀系数;退火处理可以减小基体中的热残余应力,有助于降低复合材料的热膨胀系数. The SiC_p/Cu composites were fabricated by squeeze cas ti ng technology for electronic packaging applications with SiC volume fraction of 55% and different particle sizes,.The microstructure observation showed that th e particles distributed uniformly and the composites were dense. The thermal exp ansion property testing indicated that the CTEs of the composites were increased non-linearly with the temperature; When SiC volume fraction was certain, the CT Es of the composite decreased with the SiC particle sizes decreasing; Annealing treatment can reduce the thermal residual stress within the matrix and was benef icial to decrease the CTEs of the composite.

关 键 词： 电子封装 复合材料 热膨胀性能

领　　域： [一般工业技术]