作　　者： ; ; ; ; ; ; ; ;

机构地区： 四川大学高分子科学与工程学院高分子材料工程国家重点实验室

出　　处： 《绝缘材料》 2005年第1期4-8,共5页

摘　　要： 采用以脂肪族二胺、芳香杂环二胺(DAMI)和芳香四羧酸二酐为原料,以N-甲基吡咯烷酮(NMP)为溶剂,合成了两种聚酰胺酸溶液,通过在玻璃板上逐层涂覆,热酰亚胺化成薄膜,制备了表面为热塑性聚酰亚胺的三层复合聚酰亚胺胶粘膜,再与铜箔热压复合制备了双面覆铜柔性印刷电路基板。三层复合聚酰亚胺胶粘膜的玻璃化转变温度为133℃,结晶熔融温度为222℃,与铜箔的平均剥离强度达到833g／cm。 In this paper,a three-layer polyimide film adhesive for bonding polyimide film and copˉper foil to produce flexible printed circuit board is studied.Two kinds of polyamic acids(PAA)are prepared by aliphatic diamine,aromatic diamine and aromatic dianhydride in NMP,The three-layer polyimide film adhesive is prepared by casting the PAAsolutions on glass plate and therˉmal-imidizing to form a sandwich of which a polyimide film is covered two sides with a thermal plastic polyimide adhesive.Double-sided FCCL is prepared by hot-pressing the three-layer polyimide film with copper foils.The three-layer polyimide film adhesive has a glass transition temperature132.98℃,crystal melt temperature211.89℃.The Double-sided FCCL has a mean peel strength between polyimide film and copper foil833g/cm and higher electrical properties.

关 键 词： 挠性印刷电路基板 聚酰亚胺薄膜 粘接剂

领　　域： [电气工程] [一般工业技术] [化学工程]