作　　者： ; ; ; ; (张峰）; (刘振华）; (王旭辉）;

机构地区： 湖南大学化学化工学院

出　　处： 《材料保护》 2005年第2期37-40,共4页

摘　　要： 对铑电镀工艺的铑盐制备、基材选择、镀液成分、镀覆条件、镀液维护及贵金属铑的回收、镀层性能等方面的研究现状进行了综述,并展望了其今后的发展趋势。 A review was given on the current state of rhodium electroplating technology, while the development tendency of the rhodium plating technology was also prospected. Thus the preparation of rhodium salts, the selection of plating materials, the plating bath composition, the processing conditions, the bath maintenance, the performance of the electroplated rhodium coating, and the (recycle) of rhodium were summarized.

关 键 词： 电镀 铑 工艺

领　　域： [化学工程]