作　　者： ; ; ;

机构地区： 江汉大学化学与环境工程学院

出　　处： 《中国塑料》 2005年第1期18-21,共4页

摘　　要： 以二苯醚树脂 (DPO)为原料 ,合成了一类新型耐高温树脂 -氨基二苯醚树脂 (ANDPO) ,用作双酚A环氧树脂 (EP)的固化剂 ,以提高环氧树脂的耐热性。采用微波技术固化EP/ANDPO体系。通过FTIR定量研究了EP/ANDPO体系的反应程度 ,利用差示扫描量热法 (DSC)和热重分析法 (TG)研究了固化体系的耐热性能 ,并与热固化进行了比较。结果表明 :微波固化显著提高了体系的固化速度和热性能。体系转化率为 95 %时 ,40 0W的微波只需10min即可完成固化 ,而热固化需要在 15 0℃固化 2 40min。微波固化产物的Tg、表观分解温度TA、温度指数Tzg分别为 172 .6℃、3 2 2℃和 2 0 0℃。而热固化产品的Tg、TA、Tzg分别为 163 .5℃、3 0 6℃和 189℃。两种固化方式所得产品的TA、Tzg均高于目前所用的芳香族胺类固化剂 ,显著提高了环氧树脂的耐热性能。 A novel heat resistant resin—amino-terminated diphenyl ether oligomer (ANDPO) was synthesized based on methoxy methine diphenyl ether resin, which was employed as a curing agent of epoxy resin. Curing of EP/ANDPO was carried out with microwave. The extent of reaction during the curing was measured with FTIR. The glass transition temperature (T g) and decomposition of the cured sample were studied using DSC and TG. Results indicated that microwave can accelerate the curing rate obviously. At a microwave power of 400 W,it took 10 minutes for EP/ANDPO system to cure completely, in contrast with 240 minutes at 150 ℃ in regular thermal curing.T g, initial decomposition temperature (T A), and temperature index (T zg ) of the microwave cured sample were 172.6 ℃, 322 ℃, and 200 ℃, respectively, which were higher than the corresponding values for regular thermal curing of 163 5 ℃, 306 ℃, and 189 ℃. This indicated that the ANDPO and microwave curing improved the thermal properties of the epoxy resin.

关 键 词： 氨基二苯醚树脂 环氧树脂 微波固化 耐热性

领　　域： [化学工程]