机构地区: 华中科技大学光电子工程系
出 处: 《半导体技术》 2005年第1期50-54,65,共6页
摘 要: 分析了MEMS的特点及封装工艺对MEMS的影响,给出了对MEMS封装的基本要求。研究了MEMS封装工艺中的一些关键技术,即硅-硅和硅-玻璃键合技术、清洗与引线键合技术、焊料贴片和胶粘技术以及气密封帽技术等,并给出了一些重要的研究结果。同时也介绍对几种MEMS惯性器件的封装要求及封装方法。 The characteristics of MEMS devices and the influences of MEMS packaging for MEMS devices are analyzed. The basic requirements of MEMS packaging are presented. Some critical technologies of MEMS packaging process, such as Si-Si bonding, Si-glass bonding, cleaning and wire bonding, solder and glue technology, and sealing cap technology, are investigated. Some important results are presented. At the end, the packaging requirements and methods of inertial MEMS devices are explained.