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平面研磨中基于磨具均匀磨损的磨具设计方法研究
RESEARCH ON DESIGN METHOD FOR LAPPING TOOL BASED ON WHICH ABRASES UNIFORMLY IN THE PLANE LAPPING PROCESS

作  者: ; ; ; ;

机构地区: 哈尔滨工业大学航天学院空间光学工程研究中心

出  处: 《机械工程学报》 2004年第11期183-187,共5页

摘  要: 首先详细地分析了固着磨料平面高速研磨中磨具均匀磨损的条件以及影响磨具均匀磨损的因素,然后根据磨具均匀磨损理论研究了磨具的设计方法和步骤,最后对按照这种方法设计出的磨具进行了使用验证。结果表明,采用这种方法设计的磨具在加工硬脆材料时,可以很容易地获得纳米级表面粗糙度的光滑表面,如在加工常压烧结SiC陶瓷密封环时,加工表面粗糙度可达2-3nm,平面度小于0.8μm:而且,加工效率高,成本低,磨具和加工工件都能在较长时间内保持较好的面形精度,非常适合于大批量工业化生产。 It is detailedly analyzed that the realization conditon and the influence factors of uniform abrasion of the lapping tool in the process of high speed plane lapping with solid abrasive, based on which the design method and procedure is proposed, and the lapping tool designed on that method is tested. The results show that a smooth surface with roughness in nm level can be readily achieved when brittle material is machined by that kind of lapping tool. For example, in the process of lapping SiC ceramic seals, not only a high quality surface with surface roughness 2-3 nm and flatness smaller than 0.8 μm, but also a high efficiency and a low cost as well as good forms of lapping tool and workpiece which can be kept for a long time can be easily obtained.

关 键 词: 磨具 均匀磨损 压强分布系数 陶瓷密封

领  域: [金属学及工艺]

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