机构地区: 华南理工大学材料科学与工程学院
出 处: 《材料导报》 2004年第6期19-21,共3页
摘 要: 多层陶瓷电容器(MLCCs)体现了电子元器件小型化、复合化、低成本、高可靠性的发展趋势。BME(BaseMetal Electrode)技术的发展促进了 Ni 内电极 MLCCs 的生产和应用。为了适应贱金属 Ni 内电极 MLCCs 还原气氛烧结需要,对介质瓷料提出了抗还原性要求,使其具有高的绝缘电阻率和长的工作寿命。综述了 BaTiO_3 基介质瓷料的抗还原性措施,涉及电子缺陷浓度的降低以及氧空位缺陷迁移的抑制,并利用缺陷化学阐述了其 A 位施主和 B 位受主掺杂的改性机理。 Multilayer Ceramic Capacitors(MLCCs)reflects the electronic components tend to be miniatur-ized,integraed,cost reduced and improved in reliability.In the course of progress,the development of base metal elec-trode(BME)technology accelerated the manufacture and widened the application area of MLCCs with nickel(Ni)in-ternal electrodes.The dielectric materials used in Ni-MLCCs must be nonreducible to maintain high insulation resis-tance and long work time limit after being fired in reducing atmosphere.This paper reviews progresses in modificationof BaTiO_3-based nonreducible dielectric material,including the decrease in electronic defects concentration and sup-pression of oxygen vacancies defect transfer.From the viewpoint of defect chemistry,mechanisms on dopants occupy-ing the A-site as donors and the B-site as acceptors are expoundecd.
关 键 词: 钛酸钡 多层陶瓷电容器 贱金属内电极 还原气氛 缺陷化学 掺杂
领 域: [电气工程]