机构地区: 西安电子科技大学机电工程学院
出 处: 《微纳电子技术》 2004年第7期39-41,共3页
摘 要: 针对在恶劣温度条件下工作的芯片热控制问题,提出由微泵、微通道、热电模块、智能控制单元、散热片以及液体管道等构成的微通道对流换热设计思想。数值仿真分析了换热微通道结构的速度和压力分布,计算了管道、微通道等部件的阻力损失和换热系统的流动阻力曲线,确定了系统必需的微泵工作性能参数,求解了微泵的最佳工况点。最后,制作了微通道对流换热装置,测得了系统流量和流动阻力,证实了可用经典流体理论来分析该系统的流动阻力。 In view of the difficulties in heat transfer control of IC applied to the bad temperature conditions,the micro-channel convection heat transfer system which was composed of the micro-pump,the micro-channel,the hot electricity mold piece,the heat radiator and the liquid pipes etc. was designed and studied. The velocity and pressure distribution of the micro-channel were calculated and simulated,the pressure loss of the pipes and the micro-channels and the whole pressure curve were calculated effectively,the necessary parameters of the micro-pump was determined,the optimum status of the micro-pump was pointed out. Finally,the experimental installation of the micro-channel convection heat transfer was fabricated,the flow rate and the fluid resistance were measured and the fluid resistance of the system can be analyzed by the classical fluid theory.
领 域: [动力工程及工程热物理] [动力工程及工程热物理]