作 者: ; ; ; (曹权根); (王恒义); (谢金平); (范小玲);
机构地区: 广东工业大学
出 处: 《印制电路信息》 2013年第S1期116-119,共4页
摘 要: 文章简述了印制电路板孔金属化用的各种钯活化液的原理和特点,提出了一种银活化液,并将其催化活性和催化效果与胶体钯进行了对比。结果表明银活化用于化学镀铜,诱导时间快,可以节约成本。 This paper describes the principles and characteristics of various PCB plated through hole palladium activating solution, we propose a silver activation solution and its catalytic activity and catalytic effects were compared with colloidal palladium. The results show that silver activation solution can quickly induce electroless copper plating, and save production cost.
领 域: [电子电信]